One of the reasons that the (111) planes are normally etched slower than (100) planes is because (100) plane has more dangling bonds for atom at Si surface.

Misalignment of a rectangular shaped mask opening relative to the direction of major flat of a (100) silicon wafer that results in a larger etched region.

Convex corners become undercut, as there is no single slow-etching (111) plane to stop on. That means convex corners will stop the anisotropic etching process.

One of the functions of the packaging is that the package acts as an interface between the MEMS and the system

Advanced packaging also provides mechanical protection, environment control (hermetic encapsulation), and management of excessive thermal energy generated (thermal management). 

Which one of the below is called “light field” or “clear field” mask? 

One of the MEMS devices that can be used to characterize surface topology of thin films is atomic force microscopy (AFM), where the cantilever beam deflects because of Van der Waals force between the cantilever beam tip and the sample.

__________ are devices that can measure a parameter of interest, typically non-electrical, and generate an electrical signal that can be processed by computers.

One of the pressure sensor types is the differential pressure sensor where the technique depends on measuring the difference between two pressure points.

Capacitive MEMS microphones are robust to dust, water and particulate matter.